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this is information on a product in full production. november 2014 docid027131 rev 1 1/10 10 BALF-NRF01E3 50 ? nominal input / conjugate match balun to nrf51822-qfaag0 nrf51422-qfaae0 and nrf51822-qfabb0 with integrated filter datasheet ? production data features ? low insertion loss ? low amplitude imbalance ? low phase imbalance ? coated csp on glass ? small footprint: < 1.5 mm 2 benefits ? very low profile ? high rf performance ? pcb space saving versus discrete solution ? bom count reduction ? efficient manuf acturability applications ? 2.45 ghz balun with integrated matching network ? matching optimized for following chipsets: nrf51822-qfaag0, nrf51822-qfabb0 and nrf51422-qf aae0 description stmicroelectronics BALF-NRF01E3 is an ultraminiature balun. the BALF-NRF01E3 integrates matching network in a monolithic glass substrate. matching impedance has been customized for the nrf51822-qfaag0, nrf51822-qfabb0 and nrf51422-qfaae0 rf transceivers. it is using stmicroelectronics ipd technology on non-conductive glass substrate which optimize rf performances. figure 1. pinout diagram (bottom view) whuplqdo/*$ ',(,' 1& 9&& %$/ $17 *1' %$/ www.st.com
characteristics BALF-NRF01E3 2/10 docid027131 rev 1 1 characteristics table 1. absolute maximum ratings (limiting values) symbol parameter value unit min. typ. max. p in input power rf in 20 dbm v esd esd ratings mil std883c (hbm: c = 100 pf, r = 1.5 k ? , air discharge) 2000 v esd ratings charge device model (jesd22-c101-c) 500 esd ratings machine model (mm: c = 200 pf, r = 25 ? , l = 500 nh) 500 t op operating temperature -40 +125 c table 2. electrical characteristics (t amb = 25 c) symbol parameter value unit min. typ. max. z out nominal differential output impedance conjugate match to: ? nrf51822-qfaag0 ? nrf51822-qfabb0 ? nrf51422-qfaae0 ? z in nominal input impedance 50 ? f frequency range (bandwidth) 2400 2540 i l insertion loss in bandwidth 2.2 2.7 db r l return loss in band 14 15 db imb phase imbalance -10 4 10 aimb amplitude imbalance -1 0.3 1 db 2f0 (4800-5080 mhz) 15.8 16.3 db 3f0 (7200-7620 mhz) 22.7 24.1 db
docid027131 rev 1 3/10 BALF-NRF01E3 characteristics 1.1 rf performances (t amb = 25 c) figure 2. wide band frequency response figure 3. insertion loss )*+] ',))wudqvplvvlrqg% ,qvhuwlrqorvvlqedqgg% )*+] figure 4. phase imbalance figure 5. amplitude imbalance 3kdvhlpedodqfhghj )*+] $psolwxghlpedodqfhg% )*+] figure 6. return loss on se port figure 7. conducted measurement with nrf51822-qfaag0 (at 4 dbm mode) 5/rq6(sruwg% )*+] 3rxw /2 + + + &rqgxfwhg3rzhug%p /,0,76 %$/)15)(
application information BALF-NRF01E3 4/10 docid027131 rev 1 2 application information figure 8. application schematic 125',& q5) *1' 3dg %$/)15)( $qwhqqd : $17 9''3$ & s) ;0+] & s) & q) 966 $17 3 3 966 '(& 3 3 $9 '' $9 '' & q) 1&ru*1' & q) 9&&bq5) 3 3 3 3 3 3 3 3 3 9'' 9'' '&& & q) 9&&bq5) & q) 9&&bq5) 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 6:',2q5(6(7 6:'&/. 5 n 966 3 3 3 3 3 3 3 3 '(& ;& ;& 3 3 3 3 3 3 3 3 3 3 3 3 3 3 125',& q5) *1' 3dg
docid027131 rev 1 5/10 BALF-NRF01E3 package information 3 package information ? epoxy meets ul94, v0 ? lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 9. package dimensions (top, profile and bottom view) table 3. package dimensions dim. mm min. typ. max. l 1.40 1.50 1.60 w 0.90 1.00 1.10 t 0.42 0.45 0.48 a 0.18 0.20 0.20 b 0.18 0.20 0.20 c 0.38 0.40 0.42 d 0.28 0.30 0.32 d ',(,' / : 7 e e f d d gg %rwwrpylhz [ \ [ z ] z * 3urilohylhz 7rsylhz
package information BALF-NRF01E3 6/10 docid027131 rev 1 figure 10. pcb layout recommendation /dqgsdwwhuq h[srvhgsdgglvwdqfh ?p /dqgsdwwhuq ohqjwk ?p /dqgsdwwhuqzlgwk ?p [?p ([srvhgsdg ?p[?p &hqwhuri4)1odqgsdwwhuq wr%$/)15)(sdg &hqwhu ?p
docid027131 rev 1 7/10 BALF-NRF01E3 package information figure 11. solder-mask recommendation solder paste ? 100 m solder stencil thickness is recommended. ? halide-free flux qualification rol0 according to ansi/j-std-004. ? ?no clean? solder paste is recommended. ? offers a high tack force to resist component movement during high speed. ? solder paste with fine particles: powder particle size is 20-45 m. placement ? manual positioning is not recommended. ? it is recommended to use the lead recogni tion capabilities of the placement system, not the outline centering. ? standard tolerance of 0.05 mm is recommended. ? 3.5 n placement force is recommended. too much placement force can lead to squeeze out solder paste and cause solder joints to short. too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. ? to improve the package placement accuracy, a bottom side optical control should be performed with high resolution. ? for assembly, a strong pcb support is recommended (especially on low thickness pcb) during solder paste printing, pick and place and reflow soldering by using optimized tools. plfurqv plfurqv plfurqv plfurqv &rsshu 6roghuvwhqflo
package information BALF-NRF01E3 8/10 docid027131 rev 1 figure 14. tape and reel specifications note: more information is available in the stmicroelectronics technical note: tn1197: ?ipad?, cspg w/o bump: package description and recommendations for use?. figure 12. marking figure 13. pad bottom view table 4. pad assignment details lga name description 6 nc not connected 5 vcc common collector voltage 4 bal+ balun positive output 3 bal- balun negative output 2 gnd ground 1 ant antenna connection [ \ [ z ] z 'rw67 orjr (&23$&.judgh [[ pdunlqj ] pdqxidfwxulqj orfdwlrq \zz gdwhfrgh ',(,' 1& 9&& %$/ $17 *1' %$/ 'rwlghqwli\lqj3lq $orfdwlrq 8vhugluhfwlrqrixquhholqj $ooglphqvlrqvduhw\slfdoydoxhvlqpp ? ? ? ? ?? ? ? ? ? 67 [[] \zz ?
docid027131 rev 1 9/10 BALF-NRF01E3 ordering information 4 ordering information figure 15. ordering information scheme 5 revision history table 5. ordering information order code marking package weight base qty delivery mode BALF-NRF01E3 syn lga 1.324 mg 5000 tape and reel(7?) %doxq ,qwhjudwhgkduprqlfilowhu 0dwfklqj q5)4)$$* q5)4)$%% q5)4)$$( /*$sdfndjh %$/)15)( table 6. document revision history date revision changes 28-nov-2014 1 initial release
BALF-NRF01E3 10/10 docid027131 rev 1 important notice ? please read carefully stmicroelectronics nv and its subsidiaries (?st?) reserve the right to make changes, corrections, enhancements, modifications, and improvements to st products and/or to this document at any time without notice. purchasers should obtain the latest relevant in formation on st products before placing orders. st products are sold pursuant to st?s terms and conditions of sale in place at the time of o rder acknowledgement. purchasers are solely responsible for the choice, selection, and use of st products and st assumes no liability for application assistance or the design of purchasers? products. no license, express or implied, to any intellectual property right is granted by st herein. resale of st products with provisions different from the information set forth herein shall void any warranty granted by st for such product. st and the st logo are trademarks of st. all other product or service names are the property of their respective owners. information in this document supersedes and replaces information previously supplied in any prior versions of this document. ? 2014 stmicroelectronics ? all rights reserved

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